Garnet Valley, PA — Majelac Technologies LLC has secured $1,450,000.00 in new commercial financing for expansion opportunities in Garnet Valley. According to the company website, Majelac Technologies provides Semiconductor Assembly and Packaging services. We offer Wafer Dicing, Die Attach, Flip Chip Attach, Wire Bonding, and Encapsulation Services. We specialize in quick turnaround IC packaging. Package capabilities include QFN, PGA, Sidebraze Dip, BGA, Open Cavity packages, custom packages.

To learn more about Majelac Technologies LLC please visit: http://www.majelac.com/

Company Contact:
610-459-8786

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